Article 10313

Title of the article



Kochegarov Igor' Ivanovich, Candidate of engineering sciences, associate professor, sub-department of design and production of electronic equipment, Penza State University (40 Krasnaya street, Penza, Russia),
Khanin Il'ya Vladimirovich, Assistant, sub-department of radio engineering and electronics systems, Penza State University (40 Krasnaya street, Penza, Russia),
Lysenko Aleksey Vladimirovich, Postgraduate student, Penza State University (40 Krasnaya street, Penza,
Yurkov Nikolay Kondrat'evich, Doctor of engineering sciences, professor, head of sub-department of design
and production of electronic equipment, Penza State University (40 Krasnaya street, Penza, Russia),
Almametov Valeriy Borisovich, Candidate of engineering sciences, associate professor, sub-department of design and production of electronic equipment, Penza State University (40 Krasnaya street, Penza, Russia), 

Index UDK



Background. The reliability of the electronic equipment is largely determined by the reliability of interconnect and assembly of printed circuit boards. Consequently, the control of the manufacture of printed circuit boards at all stages of production with the use of automated equipment is important. The aim of the study is to create a virtual instrument in LabVIEW environment, allowing to perform the analysis of the printed circuit board on high technological standards, to unmask obvious and latent defects. For latent defects, that do not fall outside the tolerable limits, their behavior modeling is performed in time and the probability of the circuit board within a predetermined time interval is marked.
Materials and methods. Methods of the structural and morphological image analysis are used for the recognition of defects in mathematical models. For mathematical models of the defects behaviour in time the finite-difference simulation method is used. Mathematical models are implemented in the LabVIEW programming environment in a standalone software module.
Results. The created virtual device runs as a stand-alone module that receives real-time image from the camera or from a prepared image file. Then the image analysis for revealing the explicit and latent defects is carried out.
The revealed defects are superimposed on an existing image printed circuit board showing the type of defect (narrow lanes printed, cracks, offset hole centers and etc.) If PCB parameters meet regulatory standard parameters, the potential locations for failure simulation is performed in time and the probability of a circuit board
within a predetermined time interval is determined.
Conclusions. The methods developed for defect detection and modeling of the behavior of the defects can be used in optical and X-ray inspection of printed circuit assemblies. The virtual device showed operational concept and it may be used for integration into existing manufacturing lines of printed circuit assemblies. 

Key words

latent defects, printed circuit Board, electronic equipment, nondestructive control, optical inspection. 

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Дата создания: 28.08.2014 14:01
Дата обновления: 28.08.2014 16:02